Powerchip Semiconductor Manufacturing Corp. (PSMC) announced on May 12 that it will join forces with 10 ecosystem partners—including ESMT, Etron, ITRI, Skymizer, DeepMentor, Zentel, AEMemory, and others—to present a dedicated 3D AI Semiconductor Solutions zone at COMPUTEX 2025 (Nangang Exhibition Center Hall 1, Booth I1111). The showcase will feature vertically integrated innovations for AI inference and image recognition applications, spanning memory, IP design, wafer stacking, and advanced packaging technologies.
Key exhibits include:
- Etron's VHMTM memory stack solutions for AI/HPC, including 3D Interposer integration for optimized bandwidth and efficiency.
- ESMT's next-gen aiPIM architecture, enabling in-memory computing with DRAM-logic integration for edge AI acceleration.
- Zentel Japan's RD-LE-HBM, a high-bandwidth, low-power memory for edge AI and IoT systems.
- ITRI and PSMC’s jointly developed MOSAIC 3D AI chip, combining logic and memory layers to reduce power, latency, and cost.
- iCatch (智成)'s ARM-based 3D WoW IC design and one-stop turnkey SoC solutions for edge AI.
- DeepMentor's AI IP optimized for LLMs and multimodal generation, enhancing model training and deployment efficiency.
- Skymizer's HyperThought AI accelerator IP supporting agentic workflows and multimodal inference in embedded and automotive devices.
- AEMemory's DDR5 PMICs, SPD HUB, and micro display driver backplane technologies built on PowerIGZO.
PSMC Chairman Frank Huang emphasized that its Wafer-on-Wafer and Interposer technologies have already been verified by global logic foundries and are in mass production. The collaborative COMPUTEX showcase reflects Taiwan's integrated strength in AI-focused semiconductor innovation.