Alex Wang | President, Powerchip Technology
(Chairman, RISC-V Taiwan Alliance)
Terry Tsao | Global Chief Marketing Officer and President, SEMI Taiwan
Frankwell Lin | Chairman, Andes Technology (Board Director, RISC-V International)
Mark Himelstein | CTO, RISC-V International
Charlie Su | President & CTO, Andes Technology
Wayne Wei-Ming Dai | President, VeriSilicon
Drew Barbier | Senior Director
SiFive Core IP Product Marketing
Shuenn-Yuh Lee | Professor of Department of Electrical Engineering, National Cheng Kung University
Steve Gu | Chief Analyst, EETimes China (ASPENCORE)
*The organizer reserves the right to amend any part of the agenda if necessary at any time without notifying each participants. Please follow the latest agenda on the event date.
Dr. Wang is president of Powerchip Technology Corporation in Taiwan. Prior to joining Powerchip in 2005, he was General Manager of Memory Group at Winbond Electronics. Dr. Wang has more than 30 years experience in the semiconductor industry encompassing technology and product development, and business and corporate management. He had start-up experience as CEO and president of Programmable Microelectronics Corp. in San Jose, California. Dr. Wang had also previously worked for Fairchild, Intel and Samsung.
Dr. Wang received B.S. in Physics at National Taiwan University, and Ph.D. in Physics at University of Illinois at Urbana-Champaign.
As the Global Chief Marketing Officer and President of SEMI Taiwan, Terry Tsao leads global marketing activities at SEMI, including strategic, operational, product, and communications marketing. Tsao also oversees the association’s programs, products, and services in Taiwan, and he is also responsible for relationships with SEMI members as well as with representatives of local industry, government, and academia. Additionally, he supports SEMI international programs serves members worldwide. He also managed SEMI South East Asia operation for 6 years as the President of SEMI South East Asia.
Prior to joining SEMI, Tsao was Managing Director of International Data Corporation in Taiwan. He has also served as APAC Marketing Director for Trend Micro, and held various management positions in Far Eastone Telecommunications, and Ogilvy.
Tsao holds an MBA from Baruch College City University, New York, and an Executive MBA from National Taiwan University.
Frankwell Lin, Chairman of Andes Technology, started his career being as application engineer in United Microelectronics Corporation (UMC) while UMC was an IDM with its own chip products, he experienced engineering, product planning, sales, and marketing jobs with various product lines in UMC. In 1995, after four years working on CPU chip product line as business director, he was transferred to UMC-Europe branch office to be its GM when UMC reshaped to do wafer foundry service, he lead UMC-Europe to migrate itself from selling IDM products to selling wafer foundry service. In 1998, after 14 years working in UMC, Frankwell switched job to work in Faraday Technology Corporation (Faraday), he lead ASIC business development as starting, then on-and-off leading ASIC implementation, chip backend service, IP business development, industry relationship development (IR), as well as Faraday’s spokesperson, in 2004, he started to lead the CPU project spin off operation of Faraday. Frankwell became co-founder of Andes Technology Corporation in 2005 when it was found up, he formally took position to be Andes’ President since 2006 and got promoted as Chairman and CEO in 2021.
Frankwell received BSEE degree of Electrophysics from the National Chiao-Tung University, Taiwan, and MSEE degree of Electrical and Computer Engineering from Portland State University, Oregon, USA. Under his management, Andes has been recognized as one of leading suppliers of embedded CPU IP in semiconductor industry. Andes also won the reputation of leading technology company with awards such like 2012 EE Times worldwide Silicon 60 Hot Startups to Watch, 2015 the Deloitte Technology Fast 500 Asia Pacific award, etc. Frankwell received accolade award of Outstanding Technology Management Performance, Taiwan, in 2015 and ERSO award in 2020 for his contribution to the high-tech industry. Frankwell is also the Board Director of RISC-V International since 2020.
Before RISC-V international Mark Himelstein was the President of Heavenstone, Inc. which concentrated on Strategic, Management, and Technology Consulting providing hardware and software product architecture, analysis, mentoring and interim management. Previously, Mark started Graphite Systems, Inc (acquired by EMC) where he was the VP of Engineering and CTO developing large Analytics Appliances using highly integrated FLASH memory. Prior to Graphite, Mark held positions as the CTO of Quantum Corp, Vice President of Solaris development engineering at Sun Microsystems and other technical management roles at Apple, Infoblox, and MIPS.
Mark has a bachelors degree in Computer Science and Math from Wilkes University in Pennsylvania and a masters degree in Computer Science from University of California Davis/Livermore. In addition to publishing numerous technical papers and holding many patents, he is the author of the book “100 Questions to Ask Your Software Organization”.
Dr. Wayne Wei-Ming Dai founded VeriSilicon in August 2001 and has served as the chairman of the board of directors, President and Chief Executive Officer since then. Prior to VeriSilicon, Dr. Dai was the Co-Chairman and Chief Technology Officer of Celestry Technologies, Inc., an EDA company, which was acquired by Cadence Design Systems in 2002. Prior to that, he was the founder, chairman of the board of directors, and Chief Executive Officer of Ultima Interconnect Technology, Inc., one of the predecessor companies to Celestry.
Dr. Dai was the founding Chairman of the IEEE Multi-Chip Module Conference, the founding Chairman of IEEE Symposium on IC/Package Design Integration and Co-Chairman of the Program Committee of the 2010 International Green Energy Forum. He was an Associate Editor for IEEE Transactions on Circuits and Systems and an Associate Editor for IEEE Transactions on VLSI Systems. He has published over 100 papers in technical journals and conferences and received the NSF Presidential Young Investigator Award from the President of United States in 1990. He was elected as one of the top ten venture-backed entrepreneurs in China in 2005, and elected as one of the 2005 top ten talents of science and technology in China. In 2007, he was honored with The Ernst & Young Entrepreneur of the Year in China. He won The Executive of the Year of 2013 ACE Award, Hurun Industry Achievement Award 2014, The Innovator of the year, APAC of 2018 ASPENCORE World Electronics Achievement Awards, The "Leading Pioneer" in 2018 Shanghai Smart City Construction, The Contributor of the year of 2019 World Electronics Achievement Awards. He is currently the Vice Chairman of Global Innovation Center, the Executive Vice President of International Union for Science and Technology Innovation, the Vice President of China Semiconductor Industry Association IC Design Branch and the President of China RISC-V Industry Consortium.
Dr. Dai received his B.A. degree in Computer Science and his Ph.D. degree in Electrical Engineering, both from the University of California at Berkeley. He was a professor in the department of Computer Engineering at the University of California at Santa Cruz.
Dr. Charlie Su is the first employee of Andes. He is in charge of product development and technical marketing. He spent over 12 years in the Silicon Valley with various technical and management positions at Sun Microsystems, Afara Websystems, C-Cube Microsystems, SGI/MIPS, and Intergraph. He made key contributions to several successful processors such as the Sun multi-core multi-threading Ultrasparc T1 and T2 processors, the C-Cube high-performance E-series MPEG media processors, the MIPS out-of-order R10K processor, and the Intergraph Clipper VLIW processor. Prior to starting Andes, he led the CPU and DSP development in Faraday Technology as Chief Architect.
Charlie obtained his Ph.D. in Computer Science from the University of Illinois at Urbana-Champaign, M.S. in Computer Science from National Tsing-Hua University, and B.S. in Electrical Engineering from National Taiwan University.
Drew has worked in the Semiconductor industry for over 10 years in various engineering and customer-facing roles. At SiFive, Drew is responsible for a variety of tasks including customer support, software and development tools, ecosystem development, documentation, and whatever makes the customer experience great.
Shuenn-Yuh Lee received the B.S. degree from the National Taiwan Ocean University, Keelung, Taiwan, in 1988, and the M.S. and Ph.D. degrees from the National Cheng Kung University, Tainan, Taiwan, in 1994 and 1999, respectively.
He is currently a Professor at the Department of Electrical Engineering, National Cheng Kung University, Tainan, Taiwan. He served as the Technical Program Chair (TPC) of the 2014/2015 International Symposium on Bioelectronics & Bioinformatics (ISBB), and the 2015 Taiwan and Japan Conference on Circuits and Systems (TJCAS). From 2013 to 2016, he serves as the Chairman of IEEE Solid-State Circuits Society Tainan Chapter. From 2016 to 2017, he serves as the Vice Chairman of IEEE Tainan Section. From 2016, he serves as the Associate Editor of IEEE Transaction on Biomedical Circuits and Systems.
His present research activities involve the design of analog and mixed-signal integrated circuits, biomedical circuits and systems, low-power and low-voltage analog circuits, and RF front-end integrated circuits for wireless communications. Dr. Lee now is a member of Circuits and Systems (CAS) Society, Solid-State Circuits Society, and Medicine and Biology Society of IEEE. He is also a member of IEICE.
Steve Gu is the Chief Analyst of EE Times China, ASPENCORE. He is the analyst team leader for China Fabless 100 Ranking and IC design market analysis project. With more than 20 years of experience in market analysis and marketing management, Steve worked for China and USA companies, both big and small, in semiconductor, electronics and hi-tech industry. He obtained MBA degree from the University of Texas at Austin and bachelor degree in electronic engineering from Nanjing University of Science & Technology.
Powerchip Technology Corporation (PTC) was founded in HsinChu Science Park in December 1994. An 8-inch fab was completed in 1996, and DRAM production commenced.
PTC has successfully transformed from a DRAM manufacturer into a foundry service provider. To further affirm its market positioning, in May 2019 PTC transferred related assets and business of its three 12-inch fabs in Taiwan to Powerchip Semiconductor Manufacturing Corp. Subsequent foundry business activities in Taiwan, including wafer fabrication and sales, shall be executed by Powerchip Semiconductor Manufacturing Corp.
After restructuring was completed, Powerchip Technology Corp. became a high-tech holding company. PTC invests in Powerchip Semiconductor Manufacturing Corp., Taiwan and Nexchip Semiconductor Corp., China.
In 2002, the first 12-inch fab began production. Eventually PTC expanded to three 12-inch fabs with a total monthly capacity of 100,000 wafers. In 2015, PTC signed an agreement with HeFei City in China establishing a joint venture, Nexchip Semiconductor Corporation (NSC), and setting up a new 12-inch fab in the local area. The fab began production in 2017.
In 2008 Powerchip’s 8-inch fab was spun off as Maxchip Electronics Corp. and entered the foundry business market. In 2018, Maxchip was renamed Powerchip Semiconductor Manufacturing Corp.
PTC has successfully transformed from a DRAM manufacturer into a foundry service provider. To further affirm its market positioning, in May 2019 PTC transferred related assets and business of its three 12-inch fabs in Taiwan to Powerchip Semiconductor Manufacturing Corp. Subsequent foundry business activities in Taiwan, including wafer fabrication and sales, shall be executed by Powerchip Semiconductor Manufacturing Corp.
After restructuring was completed, Powerchip Technology Corp. became a high-tech holding company. PTC invests in Powerchip Semiconductor Manufacturing Corp., Taiwan and Nexchip Semiconductor Corp., China.
Visit Powerchip:http://www.powerchiptech.com/
Andes Technology Corporation is a public listed company with well-established technology and teams to develop innovative high-performance/low-power 32/64-bit processor cores and associated development environment to serve worldwide rapidly growing embedded system applications.
The company delivers the best super low power CPU cores, including the new RISC-V series with integrated development environment and associated software and hardware solutions for efficient SoC design. Up to the end of 2019, the cumulative volume of Andes-Embedded™ SoCs has reached 5 billion.
To meet the demanding requirements of today's electronic devices, Andes Technology delivers configurable software/hardware IP and scalable platforms to respond to customers' needs for quality products and faster time-to-market. Andes Technology's comprehensive CPU includes entry-level, mid-range, high-end, extensible and security families to address the full range of embedded electronics products, especially for connected, smart and green applications. From 2017, Andes expands its product line to RISC-V processors and provides a total solution in V5 family cores, including N22, N25F/NX25F, D25F, A25/AX25, A25MP/AX25MP, A27/AX27/NX27V, A45/D45/N45 and AX45/DX45/NX45.
For more information about Andes Technology, please visit
www.andestech.com
VeriSilicon is committed to providing customers with platform-based, all-round, one-stop custom silicon services and semiconductor IP licensing services leveraging its in-house semiconductor IP. Under the unique "Silicon Platform as a Service" (SiPaaS) business model, depending on the comprehensive IP portfolio, VeriSilicon can create silicon products from definition to test and package in a short period of time, and provides high performance and cost-efficient semiconductor alternative products for IDM, Fabless, system vendors (OEM/ODM) and large Internet companies.
VeriSilicon presents a variety of customized silicon solutions, including high-definition video, high-definition audio and voice, In-Vehicle Infotainment, video surveillance, IoT connectivity, data center, etc. In addition, VeriSilicon has five types of in-house processor IPs, namely GPU IP, NPU IP, VPU, DSP IP and ISP IP, and more than 1,400 analog and mixed signal IPs and RF IPs.
Founded in 2001, and headquartered in Shanghai, China, VeriSilicon has 5 design and R&D centers in China and the United States, as well as 10 sales and customer service offices worldwide. VeriSilicon currently has more than 1000 employees.
Visit Verisilion: https://www.verisilicon.com/
SiFive is the leading provider of processor cores, accelerators, and SoC IP to create domain-specific architecture based on the open RISC-V instruction set architecture specification. SiFive offers scalable, configurable processor cores pre-integrated with security, trace, and debug features for workload-specific accelerator designs. Founded by the inventors of RISC-V, SiFive has design centers worldwide. SiFive recently announced the SiFive Performance family of processors as a significant milestone in SiFive’s commitment to delivering a complete, scalable portfolio of RISC-V cores. In this session, Drew Barbier, Senior Director of Product Marketing, will introduce the Performance P270 and P550, both available now, and how SiFive continues to set the standard in RISC-V architecture.
Visit SiFive’s website: https://www.sifive.com/
Egis Technology Inc. (Egis) specializes in the IC design, research and development, and the testing and sales of capacitive and lens type fingerprint sensors. The combination of our IC’s high resolution, small size, and low cost makes it the ideal choice for implementation. Egis is the one-stop shop for all your fingerprint sensor needs. With more than one hundred patents worldwide, we are committed to providing solutions with more innovation, more foresight and simpler, intuitive user experience, creating superior value for customers.
Visit Egis Technology:https://www.egistec.com/