HSINCHU, Taiwan – eMemory today announced that its NeoMTP has been qualified on TSMC’s Third-Generation 0.18μm Bipolar-CMOS-DMOS (BCD) process to provide IoT power-management solutions and cost competitiveness.
eMemory’s NeoMTP is a popular choice for chip designers making products for power management in USB Type-C devices and wireless chargers. TSMC provides foundry's most comprehensive and competitive Bipolar-CMOS-DMOS (BCD) Power Management process technologies. Today’s new implementation of NeoMTP on TSMC Third-Generation 0.18μm BCD Process offers IC designers the advantages of higher integration, smaller footprint and lower power consumption.

Wireless charging has become a standard feature for mobile devices and in other types of IoT applications. Demand is growing for SoC controllers that combine an MCU and a power stage with integrated memory for code storage. NeoMTP is perfectly suited for such designs.

Compared with more traditional OTP or external EEPROM solutions, a wireless charger controller with MTP provides more flexible programmability and less system design redundancy.

“eMemory is the leading NVM choice in the power-management field,” said Michael Ho, eMemory Vice President of Business Development. “Our NeoMTP on TSMC’s Third-Generation 0.18μm BCD Process brings forward some unique features which provide designers with significant advantages in these fast-growing markets.”

The unique features of the NeoMTP IP include low testing cost because no wakeup is necessary. It can also be easily mass programmed. Fast PGM/chip ERS and multi-DUT testing capability are also supported.

Other features of NeoMTP include:

- Full compatibility with the standard CMOS logic process

- Wide operating voltage range

- High reliability and high-temperature operation

- Data retention for more than 10 years after 1,000 write cycles

NeoMTP density reaches an upper limit of 8K32, allowing features like I/O numbers to be customized to meet different requirements without the need to add extra masks.

eMemory has provided NeoMTP on TSMC’s Third-Generation 0.18μm BCD platform to help design houses achieve working silicon all in one go, thereby improving time to market.

SOURCE: CTIMES