2020 RISC-V Taipei Day

貴賓介紹

王其國
力晶科技總經理
(台灣RISC-V聯盟會長): 王其國
力晶科技總經理
(台灣RISC-V聯盟會長)

Dr. Alex Wang, President, Powerchip Technology
王其國博士現任(臺灣)力晶科技公司總經理，在半導體產業有35年技術研發、事業管理經驗。在2005年參加力晶前擔任(臺灣)華邦電子公司記憶產品事業群總經理。曾在(美國矽谷)創業Programmable Microelectronics 公司任CEO，並曾服務於Fairchild, Intel和Samsung 公司。
王其國畢業于國立臺灣大學，並獲美國香檳城伊利諾大學碩士及博士學位，指導教授為CMOS發明人薩支唐 (C.T. Sah)教授。

Dr. Wang is president of Powerchip Technology Corporation in Taiwan. Prior to joining Powerchip in 2005, he was General Manager of Memory Group at Winbond Electronics. Dr. Wang has more than 30 years experience in the semiconductor industry encompassing technology and product development, and business and corporate management. He had start-up experience as CEO and president of Programmable Microelectronics Corp. in San Jose, California. Dr. Wang had also previously worked for Fairchild, Intel and Samsung.
Dr. Wang received B.S. in Physics at National Taiwan University, and Ph.D. in Physics at University of Illinois at Urbana-Champaign.
曹世綸
全球行銷長暨台灣區總裁
SEMI國際半導體產業協會: 曹世綸
全球行銷長暨台灣區總裁
SEMI國際半導體產業協會

身為SEMI全球行銷長暨台灣區總裁，曹世綸領導SEMI的全球協會行銷與市場經營計畫，包括策略擬定、協會營運、產品行銷與市場溝通，同時負責SEMI在台灣區的所有活動計劃、產品和服務內容。曹世綸在台灣除致力經營SEMI會員的合作關係，並且透過多元的管道與方式拓展與產業、政府和學術界的合作關係；此外，他也同步支援SEMI在國際上的產業推廣計畫，並為全球會員提供最佳服務。他曾擔任SEMI東南亞區總裁長達6年，負責SEMI東南亞的營運拓展與經營規劃。
在加入SEMI之前，曹世綸曾任IDC國際數據資訊台灣區董事總經理，也曾擔任趨勢科技全球及亞太區行銷協理，並曾在遠傳和奧美廣告公司擔任過多個重要行銷職位。
曹世綸擁有紐約市立大學MBA(管理/資行銷)以及台灣大學EMBA(管理/資訊科技)學位。

As the Global Chief Marketing Officer and President of SEMI Taiwan, Terry Tsao leads global marketing activities at SEMI, including strategic, operational, product, and communications marketing. Tsao also oversees the association’s programs, products, and services in Taiwan, and he is also responsible for relationships with SEMI members as well as with representatives of local industry, government, and academia. Additionally, he supports SEMI international programs serves members worldwide. He also managed SEMI South East Asia operation for 6 years as the President of SEMI South East Asia.
Prior to joining SEMI, Tsao was Managing Director of International Data Corporation in Taiwan. He has also served as APAC Marketing Director for Trend Micro, and held various management positions in Far Eastone Telecommunications, and Ogilvy.
Tsao holds an MBA from Baruch College City University, New York, and an Executive MBA from National Taiwan University.
Calista Redmond
執行長
RISC-V International: Calista Redmond
執行長
RISC-V International

Calista Redmond is the CEO of RISC-V International with a mission to expand and engage RISC-V stakeholders, compel industry adoption, and increase visibility and opportunity for RISC-V within and beyond RISC-V International. Prior to RISC-V International, Calista held a variety of roles at IBM, including Vice President of IBM Z Ecosystem where she led strategic relationships across software vendors, system integrators, business partners, developer communities, and broader engagement across the industry. Focus areas included execution of commercialization strategies, technical and business support for partners, and matchmaker to opportunities across the IBM Z and LinuxOne community. Calista’s background includes building and leading strategic business models within IBM’s Systems Group through open source initiatives including OpenPOWER, OpenDaylight, and Open Mainframe Project.

林志明
晶心科技總經理
(台灣RISC-V聯盟副會長): 林志明
晶心科技總經理
(台灣RISC-V聯盟副會長)

林志明總經理，晶心科技
林志明總經理進入職場是以聯華電子公司（UMC）的產品應用工程師作為開始，當時聯華電子是擁有自己晶圓廠與晶片產品的垂直整合型半導體公司（IDM），他在UMC期間擔任過各種晶片產品線的工程、應用工程、產品規劃、銷售和行銷工作。 1995年，在擔任了四年CPU晶片產品線業務與行銷部門經理的工作後，他被調職到聯華電子歐洲子公司（UMC-Europe）成為子公司總經理，當時UMC正在進行重塑經營模式，由擁有自己晶圓廠與晶片產品的垂直整合型經營模式轉變為晶圓代工服務模式，林總經理帶領UMC-Europe團隊從銷售 IDM自有晶片產品過度轉型為純粹銷售晶圓代工服務。

1998年年底，林總經理在UMC-Europe任期滿三年離歐返臺，此時他已在UMC服務超過十四年，林總經理轉職到智原科技股份有限公司（Faraday），在Faraday 他由領導ASIC業務發展開始，歷經帶領ASIC Implementation、晶片後端生產服務、晶片測試與產品工程、IP業務發展、產業公共關係（IR），以及擔任Faraday 的董事會董事與發言人。2004年，他開始領導CPU專案及成立公司專案，此專案於 2005年三月正式成立晶心科技股份有限公司（Andes），林總經理並為協同創辦人，Andes成立後，他自2006年以來就正式擔任Andes 總經理。林總經理獲得國立交通大學電子物理學士學位，以及美國俄勒岡州波特蘭州立大學的電機與電腦工程碩士學位。在他的管理下，Andes被公認為半導體IC設計產業嵌入式CPU IP的領先供應商之一。 Andes還贏得了領先的技術公司的聲譽，例如2012年被EE-Times 列為全球Silicon 60 Hot Start-up to Watch，2015年德勤頒贈 Asia-Pacific Technology Fast 500獎座等；2015年，林總經理獲得了台灣卓越技術管理績效獎，以表彰他對高科技產業的貢獻。

Frankwell Lin,
Andes Technology President and RISC-V International Association Board Director

President Lin started his career being as application engineer in United Microelectronics Corporation (UMC) while UMC was an IDM with its own chip products, he experienced engineering, product planning, sales, and marketing jobs with various product lines in UMC. In 1995, after four years working on CPU chip product line as business director, he was transferred to UMC-Europe branch office to be its GM when UMC reshaped to do wafer foundry service, he lead UMC-Europe to migrate itself from selling IDM products to selling wafer foundry service. In 1998, after 14 years working in UMC, President Lin switched job to work in Faraday Technology Corporation (Faraday), he lead ASIC business development as starting, then on-and-off leading ASIC implementation, chip backend service, IP business development, industry relationship development (IR), as well as Faraday's spokesperson, in 2004, he started to lead the CPU project spin off operation of Faraday. President Lin became co-founder of Andes Technology Corporation (Andes) in 2005 when it was found up, he formally took position to be Andes' President since 2006. President Lin received BSEE degree of Electrophysics from the National Chiao- Tung University, Taiwan, and MSEE degree of Electrical and Computer Engineering from Portland State University, Oregon, USA. Under his management, Andes has been recognized as one of leading suppliers of embedded CPU IP in semiconductor industry. Andes also won the reputation of leading technology company with awards such like 2012 EE Times worldwide Silicon 60 Hot Startups to Watch, 2015 the Deloitte Technology Fast 500 Asia Pacific award, etc. In 2015, President Lin received accolade award of Outstanding Technology Management Performance, Taiwan, for his contribution to the high-tech industry.
徐國程
副總經理
芯原台灣: 徐國程
芯原台灣
副總經理

▸ 經歷 :
芯原台灣 – 副總經理平台解決方案銷售及技術服務
思略科技 – 應用工程部部經理
▸ 學歷 :
國立交通大學 - 資訊工程學系碩士/學士
Michael Shyu
VeriSilicon Microelectronics - VP of Platform Solution Sales and Technical Support
Celestry Design Technology – Director of AE
National Chiao Tung University – Computer Science Engineering (BD/MD)
姚嘉洋
資深分析師
拓墣產業研究院: 姚嘉洋
資深分析師
拓墣產業研究院

玄奘大學企業管理系學士，曾在CTIMES、電子技術雜誌月刊等科技產業媒體服務七年，採訪領域橫跨EDA(電子設計自動化)、MCU(微控制器)、處理器與類比元件等多元領域。目前於TrendForce旗下拓墣產業研究院資深分析師，研究領域涵蓋IDM與Fabless的市場競合策略、晶片設計與相關各類終端應用。

Education: B.B.A., Hsuan Chuang University. Yao has seven years of experience as a technology news journalist providing in-depth reporting on topics such as EDA, processors, MCU, and analog components. As a senior analyst at TRI, His current research areas include co-opetitive strategies between IDMs and fabless companies, as well as chip design and its related applications.

徐志亮
嵌入式平台亞洲區經理
Mentor, a Siemens Business: 徐志亮
嵌入式平台亞洲區經理
Mentor, a Siemens Business

徐志亮任職於Mentor, a Siemens Business嵌入式平台部門的亞洲區域經理，在即時作業系統，嵌入式Linux，客製化嵌入式軟體服務，以及開發工具方面擁有20年的經驗。
在加入Mentor之前，徐志亮曾在MontaVista擔任大中華區和南亞區域協理。也曾任Wind River開發工具部門的事業開發經理。
徐志亮擁有元智大學的資訊工程碩士學位，以及中原大學的資訊工程學士學位。

Julian Hsu is the regional manager of Asia for embedded platform solutions at Mentor, a Siemens Business, with 20 years of experience on RTOS, embedded Linux, professional services, and development tools.
Prior to join Mentor, Julian worked for MontaVista, as regional director for Greater China and South Asia. And has also been business development manager for the development tools group of Wind River Systems.
Julian has a MS in Computer Engineering and Science from Yuan-Ze University, and a BS in Information Computer Engineering from Chung Yuan Christian University.
黃英哲
資訊工程學系教授
國立中山大學: 黃英哲
資訊工程學系教授
國立中山大學

黃英哲教授於1986年自國立台灣大學電機工程學系畢業後，即負笈前往海外留學，並於1989年及1994年分別取得美國南加州大學計算機工程碩士及博士學位。目前黃教授任教於國立中山大學資訊工程學系，並曾於2008~2009年間前往美國加州大學爾灣分校擔任客座教授。
黃教授的研究領域包含計算機結構、系統晶片平台、VLSI電腦輔助設計、系統軟體、嵌入式系統以及軟硬體整合設計/驗證。黃英哲教授與IC相關產業建立了長遠而堅實的合作關係，並技術授權給晶心科技、信億科技、耘碩科技、演算科技、智原科技、創意電子、奇景光電、盛群半導體、新華電腦、金麗科技、虹晶科技、工研院、倚強科技、威盛電子等業界公司。
近年來，黃教授深耕於即時追蹤、除錯、驗證和先進匯流排監控等系統晶片相關架構與矽智財。此外，黃教授帶領由資工系多位教授共同合作組成的研發團隊，踏足3D圖形處理器領域，進行三維圖學/立體視覺系統晶片之軟硬體整合與開發。其晶片相關領域涵蓋之技術包括：電腦圖學演算法、應用層介面、韌體、編譯器、裝置驅動程式、作業系統、開發環境、低功耗設計、系統模組建構、硬體架構、系統晶片之整合/監控/除錯/測試、FPGA/Chip實作與驗證等。在黃教授的領導下，該研究團隊分別榮獲2010年及2013年科技部國家型科技計畫「績優團隊獎」。
此外，黃教授更以其豐富的教學、研究、實作及產學合作的經驗積極參與科普教育，藉以啟發青少年及社會對於資訊科技的興趣，以奠定良好的數理基礎及培養創新的態度。他盡量自台灣本地的學術界、工業界、社會事件取材，拉近社會大眾與台灣產業及學術界的距離，也藉此機會讓台灣發光!
黃教授為中山大學日月光半導體講座教授、特聘教授，以及中山大學數位內容及多媒體技術中心主任；過去曾擔任中山大學產學營運中心副主任、中山大學資工系系主任、VLSI Design/CAD Symposium 2016大會主席。此外，黃教授亦榮獲許多獎項之肯定，包含：中國工程師學會「傑出工程教授獎」(2007)、國立中山大學產學績優獎(2016)、發明獎(2005、2007)、德國紐倫堡國際發明展「金牌」(2011)、瑞士日內瓦國際發明展二座「銀牌」(2013)、台北國際發明展「金牌」及「銀牌」(2013)、經濟部「103年國家發明創作獎」發明獎「銀牌」(2014)、科技部「未來科技突破獎」(2018)、中山大學優良導師獎(1999) 等。

Bibliography
Ing-Jer Huang received the BS degree in electrical engineering from National Taiwan University, Taiwan, R. O. C., in 1986, and the MS and Ph.D. degrees in computer en¬gineering from the University of Southern California, U. S. A., in 1989 and 1994, re¬spectively.
He is currently a professor in the Department of Computer Science and En¬gineering at National Sun Yat-Sen University, Taiwan, R. O. C. His research interests include computer architecture, SoC design and infrastructure, design automation, system software, embedded systems, and hardware/software co-design/verification, AIoT, smart aquaculture, science communication. He has actively involved in academic, educational and industrial activities.
李政崑
資訊工程學系教授
國立清華大學: 李政崑
資訊工程學系教授
國立清華大學

李政崑教授於1984年畢業於國立臺灣大學資訊工程學系，之後分別於1991年和 1992年獲得美國印第安納大學資訊工程學系碩士和博士學位，在美國印第安納大學期間是開發第一版pC ++語言和SIGMA系統團隊的主要成員。
李教授現職為國立清華大學資工系教授，他的論文“Data Distribution Analysis and Optimization for Pointer-Based Distributed Programs”曾獲得ICPP ’97頒發最原創論文獎，所指導之博士生於1999年獲得IICM授予的傑出論文獎。他個人亦於2001年獲得台灣教育部的大學與工業界聯合研究成就獎。
2009年李教授獲得了Google研究獎。隔年，他還獲得了台灣經濟部大學產業經濟貢獻奬「產業深耕獎」。李教授以開發 VLIW DSP編譯器而聞名。從2015年10月到2018年2月，他參與了新版本的Khronos OpenCL提案和OpenCL DSP Profile提案。目前，他領導著研究團隊，致力於開發具有SIMD計算功能的RISC-V的AI編譯器。他目前的研究興趣包括編譯器優化，嵌入式多核心編譯器和系統以及計算機架構。

Jenq-Kuen Lee received the B.S. degree in computer science from National Taiwan University in 1984. He received the M.S. and Ph.D. degrees in 1991 and 1992, respectively, in computer science from Indiana University. He is now a professor in the Department of Computer Science at National Tsing- Hua University, Taiwan, where he joined the Department in 1992. He was a key member of the team who developed the first version of the pC++ language and SIGMA system while at Indiana University. He was a recipient of the most original paper award in ICPP ’97 with the paper entitled “Data Distribution Analysis and Optimization for Pointer-Based Distributed Programs”. His supervised Ph.D. student received the distinguished dissertation award as honorable mention by IICM, 1999. He received an achievement award from MOE of Taiwan for University and Industrial joint research, 2001. He received a Google research award 2009. In addition, he is a recipient of Taiwan MOEA economic contribution award (Deep Plow Award), 2010. He is known to develop a PAC VLIW DSP compiler. From Oct. 2015 to Feb. 2018, he participated in the new version of Khronos OpenCL proposals with OpenCL DSP Profile Proposals. Currently, he leads a research team for the effort to develop AI compilers with RISC-V with SIMD computations. His current research interests include optimizing compilers, embedded multicore compilers and systems, and computer architectures.

陳添福
資訊學院副院長
國立交通大學: 陳添福 Tien-Fu Chen
資訊學院副院長
國立交通大學

陳添福教授專長於處理器架構及AI軟硬體系統，在國際計算機結構與嵌入式系統領域享有盛名，論文累計cited 超過2800多次，論文亦為工業界達30幾篇專利所引用。曾負責科技部多項整合型計畫總主持人，帶領研究團隊於榮獲「國科科會整合型績優計畫獎」。過去在擔任國網中心副主任期間，帶領團隊負責建置國內最大臺灣杉二號AI大型主機並開發創新服務。目前擔任台灣AI晶片聯盟「AI系統軟體」分項召集人，整合國內近30家IC設計公司，協力開發AI系統軟體與介面標準。

Prof. Tien-Fu Chen’s research interests are on computer architectures and AI system design. He is internationally recognized for contributions on scalable computing architectures, memory design, and embedded systems optimization. He published several widely‐cited top-tier international papers (2800+ Google citations) and even more several papers were cited by 30+ industrial patents. As Deputy Director, National Center for High‐Performance Computing, he led a team to build the largest scale AI sever cluster, TAIWANIA II. Currently he serves as a chair of the AI System SIG in the AI on Chip Taiwan Alliance (AITA). The primary mission is to foster a truly vertical integration in the AI system industry and set up an AI design and verification platform so that its members can take a reference for their product development.
陳中和
電機工程學系教授
成功大學: 陳中和 Chung-Ho Chen
電機工程學系教授
成功大學

▸ Education:
1993 PhD, University of Washington, Seattle, U.S.A.

▸ Research Interests
Computer architecture
AI accelerator, SIMT GPGPU
ESL system and SoC system integration
Fault-tolerant computing system

▸ Experience
1986~1987 Engineer, Philips Electronics, Inc. Taiwan
1989~1993 Research assistant, Department of Electrical Engineering, University of Washington
1993~1997 Associate professor, Department of Electronic Engineering, National Yunlin Institute of Technology
1997~1999 Associate professor, Department of Electronic Engineering, National Yunlin University of Science and Technology
1999~2006 Associate professor, Department of Electrical Engineering, National Cheng Kung University
2006~ present Professor, Department of Electrical Engineering, National Cheng Kung University
2011~2012 IEEE Circuit and System Society Tainan Chapter Chair
2012~ present 國際電機電子工程師學會中華民國第一分會常務理事
2014-2017 Director, Institute of Computer and Communication Engineering, National Cheng Kung University
2020-present, Deputy Section Chair, IEEE Tainan section

▸ 學歷:
1993 華盛頓大學電機博士

▸ 經歷:
1986~1987 台灣飛利浦電子工程師
1989~1993 華盛頓大學電機系研究助理
1993~1997 國立雲林技術學院電子系副教授
1997~1999 國立雲林科技大學電子系副教授
1999~2006 國立成功大學電機系副教授
2006~ 迄今國立成功大學電機系教授
2011~2012 IEEE Circuit and System Society Tainan Chapter Chair
2012~ 迄今國際電機電子工程師學會中華民國第一分會常務理事
2014~ 迄今國立成功大學電腦與通信工程研究所所長

▸ 研究專長:
計算機架構
VLSI 晶片設計
SoC系統整合
容錯處理系統
伍志彬
資深技術支援工程師
美商芮博士半導體: 伍志彬 Stephen Wu
資深技術支援工程師
美商芮博士半導體

在系統開發和集成電路行業擁有十多年的經驗。
經常討論安全威脅場景以及如何有效地將SOC和終端設備的安全硅IP和軟件解決方案實施到客戶手中。

學歷: SYRACUSE UNIVERSITY, Syracuse, NY Master of Science in Electrical and Computer Engineering

Had over a decade working experience in both system development and Integrated Circuit industries.
Frequently discuss the security threat and how to effectively implement Secure Silicon IP and Software solutions into SOC and end devices to customers.

Education:
SYRACUSE UNIVERSITY, Syracuse, NY Master of Science in Electrical and Computer Engineering

蔡本中
台灣區應用工程師
IAR Systems Taiwan: 蔡本中
台灣區應用工程師
IAR Systems Taiwan

蔡本中(Ben Tsai) 是瑞典商IAR Systems台灣區應用工程師，負責對台灣地區客戶技術支援及開發新應用、新市場，及新產品需求，協助推廣嵌入式集成開發工具Embedded Workbench到相關的產業，涵蓋ARM/RISC-V C/C++編譯器、程式優化、功能安全、以及IP安全保護。在電子產業擁有20年的程式設計經驗，畢業於國立清華大學化學工程研究所。

Ben Tsai is a field application engineer of IAR Systems Taiwan and he is responsible for the technical support and development of new applications, new markets, and new products in Taiwan. IAR Embedded Workbench is a leading integrated development environment for the embedded system.
It provides C/C++ compiler that generates the fastest performing, most compact code in the industry for ARM/RISC-V based applications. IAR also provides certified editions of IAR Embedded Workbench for functional safety and a security development tool that works as an extension to IAR Embedded Workbench and enables you to easily protect an existing or new application, without having to master the deeper complexities of security. Ben Tsai has 20 years of programming experience. He received his master’s degree in Chemical Engineering from National Tsing Hua University.

贊助夥伴

力晶科技
LEAD SPONSOR: 力晶科技股份有限公司
Powerchip Technology Corporation (PTC)

力晶科技於1994年12月創立於新竹科學園區，1996年八吋晶圓廠竣工投產DRAM；2002年首座十二吋晶圓廠正式量產，並逐步擴展至總月產能達十萬片的三座十二吋晶圓廠。2015年力晶科技與中國安徽省合肥市政府建投集團合資成立晶合集成電路公司，於當地新建十二吋晶圓廠2017年投產。

2008年力晶科技旗下八吋廠分割獨立為鉅晶電子(股)公司，進入晶圓代工市場。2018年鉅晶更名為力晶積成電子製造股份有限公司（簡稱‘力積電’）。

力晶科技由DRAM製造成功轉型至晶圓代工業後，為明確產業定位，2019年5月將位於台灣的三座十二吋晶圓廠相關資產、業務分割讓與力積電，由力積電主導台灣晶圓代工產銷。完成企業重組後，力晶科技成為高科技控股公司，目前主要投資台灣力積電、大陸晶合兩家專業晶圓代工廠。

Powerchip Technology Corporation (PTC) was founded in HsinChu Science Park in December 1994. An 8-inch fab was completed in 1996, and DRAM production commenced.

In 2002, the first 12-inch fab began production. Eventually PTC expanded to three 12-inch fabs with a total monthly capacity of 100,000 wafers. In 2015, PTC signed an agreement with HeFei City in China establishing a joint venture, Nexchip Semiconductor Corporation (NSC), and setting up a new 12-inch fab in the local area. The fab began production in 2017. In 2008 Powerchip’s 8-inch fab was spun off as Maxchip Electronics Corp. and entered the foundry business market. In 2018, Maxchip was renamed Powerchip Semiconductor Manufacturing Corp.

PTC has successfully transformed from a DRAM manufacturer into a foundry service provider. To further affirm its market positioning, in May 2019 PTC transferred related assets and business of its three 12-inch fabs in Taiwan to Powerchip Semiconductor Manufacturing Corp. Subsequent foundry business activities in Taiwan, including wafer fabrication and sales, shall be executed by Powerchip Semiconductor Manufacturing Corp. After restructuring was completed, Powerchip Technology Corp. became a high-tech holding company. PTC invests in Powerchip Semiconductor Manufacturing Corp., Taiwan and Nexchip Semiconductor Corp., China.
晶心科技
LEAD SPONSOR: 晶心科技股份有限公司
Andes Technology Corporation

關於晶心
過去15年，因應快速發展的全球嵌入式系統應用，晶心科技致力成為創新高效能、低功耗32及64位元處理器核心和相關開發環境的世界級創建者。晶心是 RISC-V國際協會的創始首席會員，也是第一家採用RISC-V作為其第五代架構 AndeStar™ 基礎的主流CPU供應商。為了滿足當今電子設備的苛刻要求，晶心提供了可配置性高的高效CPU核心、功能齊全的整合開發環境和全面的軟/硬體解決方案，可幫助客戶在短時間內創新其SoC設計。在2019年，Andes-Embedded™ SoC的年出貨量突破15億顆，累積出貨量超過50億顆。晶心科技全面的RISC-V CPU系列涵蓋了入門級32位元N22、中階32位元N25F/D25F/A25/A27和64位元 NX25F/AX25/AX27以及高階多核A(X)25MP和向量處理器NX27V，近期則將推出最新超純量的45系列。

About Andes Technology
Andes Technology Corporation is a public listed company with well-established technology and teams to develop innovative high-performance/low-power 32/64-bit processor cores and associated development environment to serve worldwide rapidly growing embedded system applications. The company delivers the best super low power CPU cores, including the new RISC-V series with integrated development environment and associated software and hardware solutions for efficient SoC design. Up to the end of 2019, the cumulative volume of Andes-Embedded™ SoCs has reached 5 billion. To meet the demanding requirements of today's electronic devices, Andes Technology delivers configurable software/hardware IP and scalable platforms to respond to customers' needs for quality products and faster time-to-market. Andes Technology's comprehensive CPU includes entry-level, mid-range, high-end, extensible and security families to address the full range of embedded electronics products, especially for connected, smart and green applications. From 2017, Andes expands its product line to RISC-V processors and provides a total solution in V5 family cores, including N22, N25F/NX25F, D25F, A25/AX25, A25MP/AX25MP, A27/AX27/NX27V, A45/D45/N45 and AX45/DX45/NX45.

For more information about Andes Technology, please visit www.andestech.com
芯原台灣
SILVER SPONSOR: 芯原台灣
VeriSilicon Holdings Co., Ltd.

芯原是一家為客戶提供平臺化、全方位、一站式晶片定制服務和半導體IP授權服務的企業，在芯原獨有的晶片設計平臺即服務（Silicon Platform as a Service, SiPaaS）經營模式下，通過基於公司自主半導體IP搭建的技術平臺，芯原可在短時間內打造出從定義到測試封裝完成的半導體產品，為包含晶片設計公司、半導體垂直整合製造商(IDM)、系統廠商和大型互聯網公司在內的各種客戶提供高效經濟的半導體產品替代解決方案。

芯原擁有多種晶片定制解決方案，包括高清視頻、高清音訊及語音、車載娛樂系統處理器、視頻監控、物聯網連接、資料中心等；此外，芯原還擁有5類自主可控的處理器IP，擁有業界最全面的IP組合，業務範圍涵蓋移動互聯設備、數據中心、物聯網(IoT)、汽車、工業和醫療設備等領域。

芯原成立於2001年，2003年於台灣設立子公司，經過十多年的經營，目前在全球設有5個設計研發中心（中國和美國），全球共有10個銷售和客戶支持辦事處，集團員工目前已超過1000人。

VeriSilicon is committed to providing customers with platform-based, all-round, one-stop custom silicon services and semiconductor IP licensing services leveraging its in-house semiconductor IP. Under the unique "Silicon Platform as a Service" (SiPaaS) business model, depending on the comprehensive IP portfolio, VeriSilicon can create silicon products from definition to test and package in a short period of time, and provides high performance and cost-efficient semiconductor alternative products for IDM, Fabless, system vendors (OEM/ODM) and large Internet companies.

VeriSilicon presents a variety of customized silicon solutions, including high-definition video, high-definition audio and voice, In-Vehicle Infotainment, video surveillance, IoT connectivity, data center, etc. In addition, VeriSilicon has five types of in-house processor IPs, namely GPU IP, NPU IP, VPU, DSP IP and ISP IP, and more than 1,400 analog and mixed signal IPs and RF IPs.

Founded in 2001, and headquartered in Shanghai, China, VeriSilicon has 5 design and R&D centers in China and the United States, as well as 10 sales and customer service offices worldwide. VeriSilicon currently has more than 1000 employees.
Mentor, a Siemens Business
SILVER SPONSOR: Mentor, a Siemens Business

Mentor, a Siemens Business 是電子硬體和軟體設計解決方案 (EDA; Electronic Design Automation) 的全球領導者，為世界上最成功的通信、半導體、電腦、消費電子、汽車電子和國防軍工公司提供優質產品、諮詢服務和支援, 可加快客戶電子及機械產品的研發速度，提高產品品質，增加成本效益。工程師可借助公司不斷推出的新產品及解決方案，以應對日趨複雜的電路板及晶片設計領域所面臨的挑戰。Mentor, a Siemens Business 擁有行業內最為豐富的頂級產品線，提供完整的SOC/IC/FPGA/PCB/SI設計工具和服務，並且是唯一一家擁有嵌入式軟體解決方案的EDA公司。
訪問我們的網站以獲取更多訊息: www.mentor.com

Mentor, a Siemens Business, is a world leader in electronic hardware and software design solutions, providing products, consulting services, and award-winning support for the world’s most successful electronic, semiconductor, and systems companies. More information,
please visit our website: www.mentor.com
Rambus Taiwan
PARTNER SPONSOR: Rambus Taiwan

美商芮博士半導體有限公司

數據. 快速. 安全

Rambus是一家領先的Silicon IP和芯片提供商，可以使數據更快，更安全。我們致力於為客戶提供首批上市的高質量存儲器，SerDes和嵌入式安全解決方案。在我們30年的歷史中，Rambus以創新和IP解決方案引領行業，解決了尖端計算系統所面臨的基本挑戰。

DATA. FASTER. SAFER

Rambus is a premier silicon IP and chip provider that makes data faster and safer. We are dedicated to delivering first-to-market, high-quality memory, SerDes, and embedded security solutions for our customers. Throughout our 30-year history, Rambus has led the industry with innovations and IP solutions that solve the fundamental challenges faced by leading-edge computing systems.

RISC-V Taipei Day 引領EDGE AI設計新革命─邊緣智慧嵌入式設計應用論壇

精彩議程

入場報到

Opening Remarks

Welcome Remarks

Keynote: RISC-V Global Momentum and View of the Future (by video)

RISC-V 邁向成為主流趨勢: 並談領先應用指標

由芯原 VIP9000 NPU 驅動的AI應用產品介紹

中場休息

中美大戰下的RISC-V生態系統的競合發展

在RISC-V架構上開發嵌入式軟體的技術考量

Q & A

Lightning Talk & Panel Discussion

交流時間&散會

貴賓介紹

王其國 力晶科技 總經理(台灣RISC-V聯盟會長)

曹世綸 全球行銷長暨台灣區總裁SEMI國際半導體產業協會

Calista Redmond 執行長RISC-V International

林志明 晶心科技 總經理(台灣RISC-V聯盟副會長)

徐國程 芯原台灣副總經理

姚嘉洋 資深分析師拓墣產業研究院

徐志亮 嵌入式平台 亞洲區經理Mentor, a Siemens Business

黃英哲 資訊工程學系 教授國立中山大學

李政崑 資訊工程學系 教授國立清華大學

陳添福 Tien-Fu Chen 資訊學院 副院長國立交通大學

陳中和 Chung-Ho Chen 電機工程學系 教授成功大學

伍志彬 Stephen Wu 資深技術支援 工程師美商芮博士半導體

蔡本中 台灣區 應用工程師IAR Systems Taiwan

會場位置

RISC-V TAIPEI DAY 09 / 25 ∣五∣ 13:00-17:00

聯絡我們

台灣RISC-V聯盟RISC-V Taiwan Alliance (RVTA)

聯絡電話

Email

贊助夥伴

LEAD SPONSOR

力晶科技股份有限公司 Powerchip Technology Corporation (PTC)

LEAD SPONSOR

晶心科技股份有限公司 Andes Technology Corporation

SILVER SPONSOR

芯原台灣 VeriSilicon Holdings Co., Ltd.

SILVER SPONSOR

Mentor, a Siemens Business

PARTNER SPONSOR

Rambus Taiwan

主辦單位

協辦單位

RISC-V Taipei Day
引領EDGE AI設計新革命─邊緣智慧嵌入式設計應用論壇

王其國
力晶科技總經理
(台灣RISC-V聯盟會長)

曹世綸
全球行銷長暨台灣區總裁
SEMI國際半導體產業協會

Calista Redmond
執行長
RISC-V International

林志明
晶心科技總經理
(台灣RISC-V聯盟副會長)

徐國程
芯原台灣
副總經理

姚嘉洋
資深分析師
拓墣產業研究院

徐志亮
嵌入式平台亞洲區經理
Mentor, a Siemens Business

黃英哲
資訊工程學系教授
國立中山大學

李政崑
資訊工程學系教授
國立清華大學

陳添福 Tien-Fu Chen
資訊學院副院長
國立交通大學

陳中和 Chung-Ho Chen
電機工程學系教授
成功大學

伍志彬 Stephen Wu
資深技術支援工程師
美商芮博士半導體

蔡本中
台灣區應用工程師
IAR Systems Taiwan

RISC-V
TAIPEI DAY
09 / 25 ∣五∣ 13:00-17:00

台灣RISC-V聯盟
RISC-V Taiwan Alliance (RVTA)

力晶科技股份有限公司
Powerchip Technology Corporation (PTC)

晶心科技股份有限公司
Andes Technology Corporation

芯原台灣
VeriSilicon Holdings Co., Ltd.